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2009³â 2¿ù
SKÇÏÀ̴нº ¿¬±¸¼Ò ¼³°è3ÆÀ
junghyun4.kim@hynix.com
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W.Cheng
2013³â 2¿ù
MKP Corp., Ltd. ±â¾÷ºÎ¼³¿¬±¸¼Ò
wjcheng@mkpsemi.com
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Siva. M.
2020³â 8¿ù
Amrita Vishwa V. Univ., India
sivaxsiva@gmail.com
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2024³â 2¿ù
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jhkim@ee.knu.ac.kr
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jaeeun.yoon@samsung.com
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2006³â 2¿ù
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hyunwook46.park@samsung.com
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sanghoon79.jung@samsung.com
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yoonjoo.eom@samsung.com
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sw47.shim@samsung.com
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jypark717@lge.com
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seungho48.song@samsung.com
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2009³â 2¿ù
LGÀüÀÚ SIC¿¬±¸¼Ò MCSÆÀ
jungchan.lee@lge.com
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À̽ÂÀç
2010³â 2¿ù
KEC(ÁÖ) IC¼³°èºÎ 
sjlee82@kec.co.kr
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À̴뿵
2010³â 8¿ù
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daeyoung@kdac.co.kr
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jhryu@koreaaero.com
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yongwoon82.kim@lge.com
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younghoon.kim@pointchips.com
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2012³â 2¿ù
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jeongwook.cho@magnachip.com
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Á¤È­¿ë
2014³â 8¿ù
Huawei Tech. R&D Center, China
zhenghuarong1@huawei.com
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2014³â 8¿ù
Alchip Technologies, China
brucez@alchip.com
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H. Das
2016³â 2¿ù
North Dakota State Univ., USA
hritom@gmail.com
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2018³â 2¿ù
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hyun0313.kim@samsung.com
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thkim7@ee.knu.ac.kr
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ÀåµÎȲ
2007³â 2¿ù
Arizona State University
dchang3@asu.edu
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2008³â 8¿ù
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arkim@ctcl.snu.ac.kr
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µµ°æȯ
2016³â 2¿ù
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dkk6386@kiria.org
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